downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Group 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content

September 21, 2020 - September 23, 2020

MEMS & Imaging Sensors Summit Logo

The Leading Summit of the Entire MEMS and Imaging Sensors Value Chain

#MEMS #imaging #Sensors

Add to Calendar 2020-09-21 00:00:00 2020-09-23 00:00:00 MEMS & Imaging Sensors Summit The Leading Summit of the Entire MEMS and Imaging Sensors Value Chain #MEMS #imaging #Sensors World Trade Center WTC 5-7 Place Robert Schuman Grenoble 38000 Frantzia Europe/Paris public

World Trade Center WTC
5-7 Place Robert Schuman
Grenoble 38000

MEMS & Imaging Sensors Summit Logo

Postponement SEMI MEMS & Imaging Sensors Summit in Grenoble

After consultation with our board, SEMI has made the decision to postpone the SEMI Europe MEMS & IMAGING SENSORS SUMMIT originally scheduled for June 22-24 at the World Trade Center WTC, Grenoble, France, out of an abundance of caution as the Novel Coronavirus (COVID-19) continues to spread. SEMI has always made the health and safety of our members and guests who attend events our top priority.

We are happy to announce that we have rescheduled SEMI Europe MEMS & IMAGING SENSORS SUMMIT to take place on September 21 - 23 at the same venue, the World Trade Center WTC, Grenoble, France.

SEMI regrets any inconvenience caused by this change, we would like to express our sincere thanks and appreciation for your understanding and support during these challenging times.

We look forward to seeing you in Grenoble on September 21st.   

Please feel free to contact Cassandra Melvin, Director of Operations, SEMI Europe at with any additional questions or concerns.


Richard Salsman
CFO & Vice President Operations

Laith Altimime
President, SEMI Europe


In 2020 we are bringing together thought leaders and industry experts from the entire MEMS and Imaging Sensors value chain to discuss the latest advancements in sensing technology and their work in driving innovation in high end applications.

Dimension is getting increasingly more important as innovation moves in all critical and consumer electronic applications. While the global electronics industry is undergoing the smartest transformation of its history, the enablers behind this transformation are working harder than ever to innovate and find solutions for empowering a sustainable future. During this summit, we will present case studies from industry front runners covering topics in sensor fusion and integrated sensing technologies as well as the rise of new industry requirements for reliability and robustness. We also give the opportunity to newcomers and young startups to demonstrate their capabilities in this highly competitive landscape by giving them the stage to present their latest technologies in the fields of sensing and imaging applications.


Tetsuo Nomoto
Tetsuo Nomoto
Head of Sony Semiconductor Solutions Europe, Senior Vice President of Sony Europe BV
Philipp von Schierstaedt
Philipp von Schierstaedt
Vice President & General Manager of Radio Frequency & Sensors, Infineon Technologies
Ralf Schellin
Dr. Ralf Schellin
Vice President and Head of Product Area MEMS, Bosch Sensortec
Francesco Profumo
Prof. Francesco Profumo
President, National Research Council (CNR), Italy


Monday, 21 September 2020

1:00 pm - 2:00 pm

Registration and Welcome Coffee

2:00 pm - 2:10 pm
Laith Altimime
Laith Altimime
President, SEMI Europe

Opening and Welcome Remarks

2:10 pm - 2:20 pm
Emmanuel Sabonnadiere

Welcome Note


2:20 pm - 2:50 pm
Tetsuo Nomoto
Tetsuo Nomoto
Head of Sony Semiconductor Solutions Europe, Senior Vice President of Sony Europe BV

Sensing Technologies and Applications

2:00 pm - 3:20 pm
Philipp von Schierstaedt
Philipp von Schierstaedt
Vice President & General Manager of Radio Frequency & Sensors, Infineon Technologies

Introducing the World’s Smallest 3D Image Sensor Chip

3:20 pm - 3:50 pm
Ralf Schellin
Dr. Ralf Schellin
Vice President and Head of Product Area MEMS, Bosch Sensortec

Algorithms, embedded AI and MEMS sensors: the silent enablers of sophisticated daily-life use cases

3:50 pm - 4:20 pm
Francesco Profumo
Prof. Francesco Profumo
President, National Research Council (CNR), Italy

Microelectronics, Sensors and Microsystems

4:20 pm - 4:50 pm

Networking Coffee Break


4:50 pm - 4:55 pm

Session Overview by the Session Chair

4:55 pm - 5:20 pm

Wide Scope Sensors Interaction with Computing - Imaging

5:20 pm - 5:45 pm


5:45 pm - 6:10 pm
Jacques Cochard
Partner, Technology Transfer & Research Valorization, TEMATYS

LiDAR Market and Technology

6:10 pm - 7:00 pm

Executive Panel Discussion with the MEMS & Imaging Sensors Steering Committee Members

7:00 pm - 9:30 pm

Evening Reception

Tuesday, 22 September 2020

7:45 am - 8:30 am

Registration and Welcome Coffee


8:30 am - 8:35 am

Session Overview by the Session Chair

8:35 am - 9:05 am

Keynote Presentation to be announced soon

9:05 am - 9:30 am

Open Innovation for Imagers’ in the Frame of the IRT 'System Lab' Platform

9:30 am - 9:55 am
Dr.-Ing. Jan Grahmann
Head of Business Unit Active Microoptical Devices and Systems (AMS)

MEMS Scanner and LIDAR

9:55 am - 10:20 am

Presentation 3.4 Case Study for Headphones with Measuring Tech STMicro

10:20 am - 10:45 am

Presentation 3.5 Analog Device

10:45 am - 11:25 am

Coffee Break


11:25 am - 11:30 am

Session Overview by the Session Chair

11:30 am - 11:40 am
Andreas Kopetz
Andreas Kopetz
Director Environmental Sensing, Infineon

XENSIV™ PAS CO2 sensor New environmental sensor technology: photoacoustic spectroscopy (PAS) miniaturizes CO2 sensor for high-volume applications

11:40 am - 11:50 am
Dr Stijn Goossens
Dr. Stijn Goosens
Research Engineer, ICFO

Enabling a World of Enhanced Vision

11:50 am - 12:00 pm
Remi Poittevin
Head of R&D AI Systems & Applications, GrAI Matter Lab

The World’s First AI Processor Optimized for Ultra-Low Latency and Low Power Processing at the Edge

12:00 pm - 12:10 pm
Tom Doyle
Tom Doyle
CEO, Aspinity

Analyze-first Architecture for Ultra-low-power Always-on Sensing

12:10 pm - 12:20 pm
Mikko Utriainen
CEO, Chipmetrics

Novel Platform to Solve 3D Nanometry Challenge

12:20 pm - 12:30 pm
Bert Kaiser
Bert Kaiser
Group Leader Research and Development, Fraunhofer IPMS

All-Silicon Ultrasonic Gesture Recognition

12:30 pm - 12:40 pm
Alexey Toropkov
Alexey Toropkov
Development Director and Co-founder, Gyrolab LLC

Complex of Inertial and Satellite Navigation, Monitoring, Control and Diagnosis

12:40 pm - 12:50 pm
John Phair
John Phair
CTO, Pyreos Ltd.

Miniature Digital IR Detectors Enabling Gas Sensing Everywhere

12:50 pm - 12:50 pm

Cast Your Vote

12:50 pm - 2:10 pm

Networking Luncheon


2:10 pm - 2:15 pm

Session Overview by the Session Chair

2:15 pm - 2:40 pm


2:40 pm - 3:05 pm


3:05 pm - 3:30 pm


3:30 pm - 3:55 pm


3:55 pm - 4:30 pm

Coffee Break


4:30 pm - 4:35 pm

Session Overview by the Session Chair

4:35 pm - 5:00 pm
Dr. Xavier Rottenburg
Scientific Director (Wave-based Sensors & Actuators), Imec

Integrated Sensors with Optical Readout: Optical Microphone and Pressure Sensors

5:00 pm - 5:25 pm


5:25 pm - 5:50 pm


5:50 pm - 6:15 pm


6:15 pm - 6:30 pm

Closing Remarks

7:00 pm - 9:30 pm

Gala Dinner

Wednesday, 23 September 2020

8:00 am - 8:30 am

Registration and Welcome Coffee


8:30 am - 8:35 am

Opening Remarks by the Session Chair

8:35 am - 9:05 am
Luca Vere
Co-Founder and CEO, Prophesee

Keynote Presentation

9:05 am - 9:30 am
Gioel Molinari
President, Butterfly Network, Inc.


9:30 am - 9:55 am
Alain Bardoux
Head of Detection, French Space Agency


9:55 am - 10:20 am


10:20 am - 11:00 am

Coffee Break


11:00 am - 11:05 am

Opening Remarks by the Session Chair

11:05 am - 11:30 am
Fumio Kita
Fumio Kita
Global Product Manager - Core Resists, Merck


11:30 am - 11:55 am
Sandra Vos
Sandra Vos
Director of Research and Development, NXP Semiconductors

Above and Beyond Methodology: Robustness Validation of Automotive MEMS Sensors

11:55 am - 12:20 pm



12:20 pm - 12:25 pm

Opening Remarks by the Session Chair

12:25 pm - 12:50 pm


12:50 pm - 1:15 pm


1:15 pm - 1:20 pm

Closing Remarks and End of the Conference

1:20 pm

Networking Luncheon


  • Access to common sessions, MEMS track, imaging track
  • Access to the exhibition area
  • All conference proceedings
  • Welcome reception, coffee breaks and lunch (gala dinner excluded)
  • B2B Matchmaking

Until 26 June 2020

  • SEMI Members: 680 EUR
  • Non-Members: 890 EUR

27 June - 31 July 2020

  • SEMI Members: 765 EUR
  • Non-Members: 965 EUR

From 1 August 2020

  • SEMI Members: 795 EUR
  • Non-Members: 995 EUR

Price for Students: 150 EUR

*price in Euro, VAT excl.


Tuesday, September 22 | 19:00 - 22:00


Chateau Sassenage
Allée du Château 
38360 Sassenage

* There will be a Bus shuttle (approx. 15-20 min drive) from and to the World Trade Center (Conference Venue).


  • Conference attendees: 70 EUR
  • Guest: 85 EUR

*price in Euro, VAT excl.

Dinner ticket can be purchased beforehand. Please contact the registration team for assistance​ 

Whether you are already part of the MEMS, imaging and sensors ecosystem, a consumer of these devices, or perhaps a startup aiming to be the next Unicorn, you should not miss this opportunity to connect with industry executives and experts from around the globe.

Attendees are invited to take advantage of excellent intentional networking opportunities which have become a highlight of the Summit. The exclusive exhibition area, which always sells out quickly, uniquely showcases the most prominent names in the industry alongside new and innovative smaller companies.

Key figures of the co-located 
events in 2019:

  • 400+ international registered attendees
  • From 25 countries
  • 4 keynotes and 50+ invited speakers
  • 51 exhibitors 
  • 10 MEMS/imaging/sensors-enabled technology demos 
  • 16 sponsors
  • 30+ association and media partners

Check out the Post Show Report of 2019 event!

Floor plan MEMS and Imaging Sensors Summit 2019

Exhibition fee:

Until 29 May:

  • SEMI Members: 2,285 EUR
  • Non-Members: 2,795 EUR

After 30 May:

  • SEMI Members: 2,680 EUR
  • Non-Members: 3,295 EUR

*price in Euro, VAT excl.

Exhibition fee includes:

  • 4 m2 Turnkey booth
  • Free conference access for one person (Access to all plenary sessions, exhibition, one-on-one business meeting service, welcome cocktail, lunches, and proceedings.)
  • Possibility to get one discounted ticket for 680 €

Modular stand includes:

  • Aluminium structure with melamine panels
  • A4 sign with company name
  • 1 Table and 2 chairs
  • 1 power socket
  • 3 spotlights
  • 1 trash bin

Reviliani Gani at

Take advantage of our B2B Matchmaking tool (free of charge) and get in touch with potential business partners before MEMS and Imaging Summit 2020! 

Identify potential business-/cooperation partners or customers using the online system for meeting requests. Search for visitors and schedule your meetings and build your custom schedule and make appointments in advance. 

  • Find new customers, suppliers and cooperation partners
  • Present yourself to visitors and exhibitors
  • Meet your future cooperation partners

Where and when:

The B2B Matchmaking area is located in the conference venue World Trade Center (WTC), on the 2nd floor in the Exhibition Area (Room Mont Blanc). Meet up at our B2B welcome counter, each time slot lasts 30 minutes. Matchmaking hours begin and end with the show hours. In addition, exhibitors can offer their booth as a meeting location. Meetings can be organized on Tuesday, September 22nd from 08:30 to 18:00; and on Wednesday, September 23rd from 8:30 to 13:00.

How it works:

All registered delegates will receive an e-mail with their personal login/information on B2B on Monday August 31st, when the platform is opening. All the agendas will be sent 1 day before the Summits begin. If you already registered for the conference but didn't sign up for the B2B Matchmaking service yet, you will still receive an e-mail with the link to inscribe. 

Not registered yet?

Don't worry, you are still on time! 
Follow the link HERE and remember to tick the box “I hereby accept that my name, job title and organization may be mentioned on the business meetings platform.” at the end of the Attendee identification and to complete the B2B Matchmaking section of MEMS and Imaging Summit registration. 

IMPORTANT Information:

Only delegates and exhibitors can participate. If you are registered as booth staff (for exhibitor badges) only, please re-register. The B2B Matchmaking requires an official registration (when registering, tick the Box “yes, I would like to participate in B2B Matchmaking” at the end of MEMS and Imaging Summit registration). Since booth staff is usually registered via one key contact with only name and email address, it is essential, that every person who would like to register for B2B Matchmaking completes the registration form.

For technical information and support, please contact:

Insight Outside at



Mems pic 12

The Summit will be held at the World Trade Center (WTC) in Grenoble, France, at the heart of the French Silicon Valley.

Address: 5-7 Place Robert Schuman, 38000 Grenoble, France

For more information about the venue please click here.

Hotel Europole

29, Rue Pierre Sémard
38000 Grenoble
Tel: +33 (0)4 76 49 51 52


Single Room: 121.25 EUR/Night (incl. Breakfast and city tax)

To make a reservation, please contact: mentioning the Code “SEMI EUROPE“



OKKO Hotel Jardin Hoche

23, Rue Hoche
38000 Grenoble
Tel : +33 (0)4 85 19 00 10


Single Room: 126.40 EUR/Night (incl. Breakfast and city tax)

To make a reservation, please contact:



HIPARK Grenoble

6 Rue Auguste Génin, 38000 Grenoble, France

Single Room: 115 €/ night (incl. breakfast)

Local city tax : 1.25€ / night / person

To make a reservation, please contact: and use the code GREALP


Terms & Conditions => Guarantee by credit card mandatory, with debit from the first night. Refund of deposit if canceled up to 15 days before arrival. 100% of the deposit remains with the establishment if the cancellation occurs 14 days until the day of arrival or the no-show


*All hotel rooms upon availability.

Mems pic 12


Silver Sponsor

spts logo

Sponsorship Opportunities

Become a MEMS & Imaging Sensors Summit 2020 sponsor!

Sponsorship of MEMS & Imaging Sensors Summit provides various ways to enhance the presence of your company through thought leadership, on-site visibility, strategic networking, and targeted marketing. SEMI members receive a 10% discount on all sponsorship. Brand your company by sponsoring MEMS & Imaging Sensors Summit 2020! The overview of this year's sponsorship opportunities of all events by SEMI Europe is available here


Adi Hodorov at


Download the event mobile app to make the most of your participation and maximize your networking experience!

Event app


CMM Web Logo
DSP Valley Logo 150 pixel height
EE Times Logo
eeNews Europe Logo
Elektronik Logo
EO Ellettoronica 150 pixel
Electronique S Logo
imicronews HPS Logo
Markt&Technik Logo
MEMS Journal Logo
Minalogic Logo
Power Electronics World Logo
Semisrael Logo
Sensors MDPI Logo
Selezione Logo 150 pixel height
Silicon Saxony Logo
Silicon Semiconductor Logo
Smart Systems Integration Logo
Technology Networks Logo
Veritas et Visus Logo
VDMA Productronic Logo


Special thanks to our steering committee members for the realization of Industry Strategy Symposium 2020!

Who are the committee members? Find out here.

Technology Showcase

The Technology Showcase will highlight some of the newest and most unique MEMS/imaging/sensors-enabled applications in the industry. 

Selected presenters will receive:
  • One complimentary pass to the summit

  • A demo table to display your technology

  • 10 minutes presentation slot to pitch the audience

  • The winners receive a FREE BOOTH for the MEMS & Imaging Sensors Summit 2021!

Any questions? Please contact: Pantelitsa Markus at