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TOKYO – November 26, 2019 – Smart mobility, smart manufacturing and business continuity planning (BCP) will come into sharp focus at SEMICON Japan 2019 as players from across the electronics supply chain gather December 11-13 at Tokyo Big Sight for the latest technology developments and innovations fueling a smarter world. Registration for SEMICON Japan 2019 is open.

SEMICON Japan Logo

SMART Transportation
Automobiles are growing in technical sophistication thanks to increasing silicon content, adding connected navigation systems, Lidar, and other connected-car features including internet radio, mobile search and cloud-based content. According to IHS Markit, microcomponent ICs will grow the fastest over the coming years among all semiconductor device categories, driven by automated driving and the rising number of sensors.

In the SEMICON Japan 2019 SMART Applications Zone, the SMART Transportation Forum will highlight next-generation usage models such as Mobility-as-a-Service (MaaS), electrification and autonomous driving. Device manufacturers will showcase the latest research and development and software platforms, and market researchers will offer insights into automotive technology trends. The area will also feature an automobile equipped with autonomous driving software.

Key SMART Transportation exhibitors include TOYOTA, DENSO, ZUKEN, Tier IV, Renesas Electronics, LIVOX TECH, Deloitte Touche Tohmatsu and Solidray.

SMART Manufacturing
The SMART Applications Zone will also feature the SMART Manufacturing Forum, where Advanced Industrial Science and Technology (AIST) will demonstrate remote control of a Minimal Fab System, and Deloitte Touche Tohmatsu will take visitors on tour of a semiconductor manufacturing fab using augmented reality (AR) and virtual reality (VR).

Other key SMART Manufacturing exhibitors include SIEMENS, Sony Semiconductor Solutions, Chuo Denshi Kogyo (CDK) and United Semiconductor Japan (USJC).

Business Continuity Planning
Business Continuity Planning has seen strong demand as companies in the semiconductor manufacturing supply chain work to deepen their cooperation with each other to sustain operations in the event of natural disasters and other emergencies. SEMICON Japan 2019 will feature an exhibition and seminar highlighting the importance of BCP to the electronics supply chain. Visitors will learn about earthquake countermeasures by stepping into the Seismic Isolation Experience Car.

Exhibitors in the BCP area in West Hall 4 include THK, DISCO, HORIBA STEC and Murata Machinery.

Representatives from Sony Semiconductor Manufacturing, THK, DISCO and Team Engineering Consulting will share lessons learned from actual disasters and discuss the vital importance of daily preparation for disasters on December 12 in the Conference Tower, room 608.

For registration and other information, please visit the SEMICON Japan 2019 website.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Mayumi Amagai
Phone: 81-3-3222-5801
Email: mamagai@semi.org