MILPITAS, Calif. — February 24, 2020 — Covering topics from yield management to metrology in the era of artificial intelligence (AI), more than 100 industry experts will deliver 35 hours of technical presentations on the latest advanced semiconductor manufacturing strategies and methodologies at SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2020), May 4-7, 2020, in Saratoga Springs, New York. Registration is now open.
Drawing an expected 400 attendees, ASMC 2020 will feature the panel discussion Exascalers, Hyperscalers: Computing at the Edge – Different Modes, Different Nodes with experts from industry leaders including Applied Materials, Binghamton University, Corning, IBM Global Think Labs and Tercero Technologies.
Back for its fifth year, the Women in Semiconductors program – May 4 in conjunction with ASMC 2020 – will highlight the importance of workplace diversity as the global semiconductor industry works to grow its talent pipeline. Joanne Kamens of Addgene will keynote the event. Registration is complimentary for ASMC attendees.
ASMC is the premier event for industry professionals to network and share insights into best practices for semiconductor manufacturing. The conference is co-chaired by Fred Bouchard of SpareTech and Armando Anaya of Northrop Grumman.
ASMC 2020 Keynotes
Thomas Sonderman, President, SkyWater Technology
Jesus del Alamo, Ph.D., Donner Professor, Professor of Electrical Engineering,
Robert Maire, Semiconductor Advisors
ASMC 2020 technical sessions include:
- Advanced Equipment Processes and Materials
- Advanced Metal Structures
- Advanced Process Control
- Contamination-Free Manufacturing
- Defect Inspection
- Factory Optimization
- Novel Metrology Techniques
- Optical Metrology and Machine Learning
- Patterning and 3D Metrology
- Smart Manufacturing
- Yield Enhancement/Yield Methodologies
ASMC also features an interactive poster session (including student presentations) and receptions for presenters and conference attendees to network.
ASMC 2020 is the fourth of eight conferences comprising SEMI’s second annual Technology Leadership Series of the Americas , a series that fosters discussions to uncover opportunities in the $2 trillion global electronics manufacturing and design supply chain.
For more conference details, contact Margaret Kindling at email@example.com or 1.202.393.5552. The media should contact Scott Stevens (for SEMI Americas communications) at firstname.lastname@example.org for registration information.
SEMI Golden Anniversary
The year 2020 marks SEMI’s golden anniversary. For half a century, SEMI has brought the industry together to connect, collaborate, innovate, and help transform the world with new technologies.
Join us at SEMICON events around the world as we celebrate 50 years of growth in global electronics manufacturing and kick off the next 50 years by highlighting the latest developments, trends and innovations in smart technologies.
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter .
Scott Stevens, Cardinal Communications for SEMI Americas